Bell System Technical Journal, v32: i3 May 1953
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Table of Contents
| Page(s) | Article Title | Author(s) |
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| 523-524 | Solderless Wrapped Connections - Introduction | McRae, J. W. |
| 525-555 | Solderless Wrapped Connections: Part I - Structure and Tools | Mallina, R.F. |
| 557-590 | Solderless Wrapped Connections: Part II - Necessary Conditions for Obtaining a Permanent Connection | Mason, W.P.; Osmer, T.F. |
| 591-610 | Solderless Wrapped Connections: Part III - Evaluation and Performance Tests | Van Horn, R.H. |
| 611-626 | An Improved Circuit for the Telephone Set | Bennett, A.F. |
| 627-646 | Automatic Line Insulation Test Equipment for Local Crossbar Systems | Burns, R.W.; Dehn, J.W. |
| 647-664 | Theory of Magnetic Effects on the Noise in a Germanium Filament | Suhl, Harry |
| 665-694 | DC Field Distribution in a Swept Intrinsic Semiconductor Configuration | Prim, R.C. |
| 695-713 | Transmission Properties of Laminated Clogston Type Conductors | Vaage, E.F. |
| 715-766 | A Coupled Resonator Reflex Klystron | Reed, E.D. |
| 767-774 | Abstracts of Bell System Technical Papers Not Published in This Journal | |
| 775-777 | Contributors to this Issue | |
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